Description
The UNICOMP AX7900 X-ray Inspection Machine is designed to produce high-resolution X-ray images, primarily for the electronics industry. This versatile system is utilized for quality control of SMD assemblies in BGA, CSP, Flip Chip, LED, Fuse, DIODE packages, and more. Additionally, these systems are employed for inspecting semiconductor packages, battery packs, and verifying the functionality and authenticity of chips.
