Description
The UNICOMP CX3000 benchtop X-ray inspection system is an X-ray camera ideal for real-time inspection of PCB mounting elements.
The CX3000 system is designed for high-resolution X-ray inspection primarily in the electronics industry and is ideal for inspection of various PCB defects such as BGA solder bead voids, control of unsoldered solder, solder contact pads, inspection of crystal holder substrates for delaminations, inspection of bends in chip connecting wires, etc. The CX3000 system is designed for high resolution X-ray inspection.
The fluoroscopy system, including increased protection of the operator (visual and audible warnings, automatic shutdown of X-ray radiation when the door is opened, etc.) fully meets international safety standards. The system includes a built-in PC. Powerful software with an interactive, user-friendly interface makes PCB inspection quick and easy.